Summary:

1. Package design for Manufacture.
2. Package level and SMT level stencil design.
3. Provide package total solution; include but not limited to Stack up discussion, layout, stencil design, timeline tracking and handle the package relevant qualification.

RESPONSIBILITIES:

1. Package design for Manufacture.
2. Need work with assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes.
3. Coordinate with the internal team to identify the module package related issues, give DFM report/ suggestions for new packages, address the root cause and find the solution.
4. Sum up the experience of package design manufacture issue, SMT process and maintain the design rule.
5. Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.;
6. Tracking new package project timeline and response to internal team.
7. Perform other tasks assigned by superiors.

REQUIREMENTS:

1. Good knowledge of package design, knowledge of design for manufacturing.

2. Hands-on experience on PCB design in SMT or PCB factory.

3. Proficient Cadence software, CAD.

4. Bachelor’s degree with 8+ years related experience.