职位详情
Assembly Engineer 封装工程师
1-1.5万
MPS(成都芯源系统有限公司)
成都
3-5年
本科
07-30
工作地址

成都高新综合保税区B区

职位描述

Summary:

Handle assembly OOC project and coordinate with related department to integrate information, monitor the project progress, and provide the required support to ensure the achievement of project objectives.

负责海外封装项目并沟通协调其他部门整合信息,监控项目进度,提供所需支持确保项目目标实现


RESPONSIBILITIES:

  • Follow up NPI process and coordinate the cross -function team to transfer required products on schedule with project target
  • 遵循新产品导入流程,协调跨职能团队根据项目目标按时转移所需产品

  • Project development process optimization and support PKG team to achieve project target
  • 优化项目开发流程,协助PKG团队完成项目目标

  • Prepare ENG wafer and EABR for PKG qual with OOC transfer list
  • 准备需要验证产品的工程晶圆与工程订单

  • Daily tracking the status in subcon for OOC qualification lot to make sure no any delay.
  • 每日跟踪OOC验证lot,确保无延期

  • Weekly and Monthly summarize all OOC eng lots status,ensure transparency and timely update of all project information
  • 每周&每月汇总OOC工程lot 进度,确保所有项目信息的透明度和及时更新

  • Use project management tools and techniques to monitor project progress.
  • 使用项目管理工具和技术监控项目进度。

  • Take corrective actions to ensure the achievement of project objectives.
  • 采取纠正措施以确保项目目标的实现

  • Other task assigned by supervisor / leader
  • 其他主管安排的任务


    REQUIREMENTS:

  • Bachelor degree, majoring in Engineering or related discipline
  • 本科学历,工程或相关专业

  • Familiar with office software
  • 熟悉办公软件

  • Cross functional leadership for project management
  • 有跨部门管理项目的能力

  • Fluent English writing and speaking skills.
  • 流利的英文书写以及口语

    以担保或任何理由索取财物,扣押证照,均涉嫌违法,请提高警惕

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