Location：Shanghai

Job Responsibilities:

Ø Responsible for routine PCB layout designs.

Ø Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design.

Ø Generate documents per design flow and rules, submit for peer review and attach to file system after that.

Ø Actively participate in technical discussions at the early design phase.

Ø Review and verify the layout designs per the checklist for others.

Ø Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases.

SKILLS/QUALIFICATIONS:

Ø BS or higher in electrical engineering or equivalent;

Ø 8+ years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design;

Ø In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules;

Ø Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density;

Ø At least as an expert in one of PCB design tools, Mentor Pads design experience and Allegro is preferred;

Ø Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred;

Ø Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus;

Ø Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirements;

Ø Good English communication skill.