Job Responsibilities:
Responsible for routine PCB layout designs.
Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design.
Generate documents per design flow and rules, submit for peer review and attach to file system after that.
Actively participate in technical discussions at the early design phase.
Review and verify the layout designs per the checklist for others.
Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases.
SKILLS/QUALIFICATIONS:
BS or higher in electrical engineering or equivalent;
5 years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design;
In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules;
Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density;
At least as an expert in one of PCB design tools, Mentor Pads design experience and Allegro is preferred;
Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred;
Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus;
Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirement.