若无该机型岗位经验，勿扰~

KEY TASKS & RESPONSIBILITIES:

工作职责:

1. Line issue analysis and disposition. 线上异常问题分析与处理

2. Assist saw singulation engineer to driving and initiating improvement activities (such as Yield improvement, Cost Saving, UPH and OEE improvement) with cross functional team.协助SAW工程师推动相关职能部门进行改善行动（如良率改善，成本节约，UPH和OEE改善）

3. Assist saw singulation engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.

协助SAW工程师用DOE方法解决问题，能编写相关报告等技能

4.Draw up SOP for line training.制定操作SOP并培训相关操作人员

5.Assist saw singulation engineer to NPI Eng and Qual lot execution, LVM and HVM support.协助SAW工程师完成新品导入及工程批生产，小批量及批量生产支持.

6.Assist saw singulation engineer to new machine, new uv tape and new saw blade qualification. 协助SAW工程师验证新设备，新材料（切割胶纸与刀片）及数据收集

7. Provide support on project initiated by others.提供工程项目技术支持

JOB REQUIREMENTS:

任职资格:

1. Associate Degree or over. 大专或以上学历

2. In Material Science, applied Physics, Electron Engineering, Mechanical Engineering or related engineering discipline.材料科学、应用物理、电子工程、机械工程或相关工程学科

3. Over 3 years working experience in related process in semiconductor saw singulation. 至少3年半导体相关工序经验

非常丰富切割工序经验（全切割与半切割）

5. Familiar Saw Singulation process related machine, Tape Saw and Jig Saw (such as Disco 6362 etc series, HANMI series, ADT, Rokko 7000S /8000P). 熟悉后道切割工序相关设备操作，胶纸与模具切割设备（如Disco6362等系列, HANMI系列, ADT, ROKKO 7000S / 8000P设备）

6.A team minded person capable of working independently, keeping a positive attitude.有团队意识的人，能够独立工作，保持积极的态度