Requirements:

l min 10years working experience in power semiconductor .

l Hands on skill for power semiconductor SMT process (Pink Vadu, Infotech, SMT reflow and die attach sintering process).

l lots of experience for DOE and statistic analysis.

l knowledge for power module (case, transfer molded) structure /technology trend, overall power packaging process and material property what is using for power package.

l understand APQP process, DFMEA,PFMEA, Control plan. Good English communication and reporting skill(mandatory option)

Job description:

SMT process set up, DOE, Sample build, jig design, trouble shooting