SUMMARY:
Quantitatively understand stress related failure in MPS products and find optimization by FEA in trouble-shooting, and predict stress risks in product design phase.
RESPONSIBILITIES:
1. Mechanical or thermal stress analysis on package level & board level;
2. Parametric analysis on ranking key impact factors for improved product reliability;
3. Provide improvement solution for IC packaging related fracture ,fatigue, warpage, interface delamination issues through FEA simulation at both early failure and long term failure stage ;
4. Classify stress related failure and accordingly the failure mechanisms;
5. Optimize device & package structure or design to mitigate cracking related failure from stress ,warpage ,material , and manufacturing perspective ;
REQUIREMENTS:
1. Education background : MS or PHD degree in Engineering Mechanics, engineering Materials; strong in mechanics of materials & fracture mechanics;
2. Hands-on experience of major FEA tools ( ANSYS, ABAQUS, Comsol , Icepak,Flotherm,etc. ) and modeling tools (e.g., Solidworks,ProE,etc);
3. Deep understanding of packaging materials (including soldering material, glue material ) and their engineering mechanical behaviors ;
4. Good at statistical data analysis ;
5. Good team player ,and able to perform independent research & development work;
6. 3+ years thermal-mechanical simulation Experience on one or more of these areas:
1) board level solder joint fatigue life simulation ;
2) big board /advanced packaging (BGA,module,chiplet )warpage simulation ;
3) SMT material & mechanical reliability : process simulation and DFM/DFR ;
4) *vibration simu for board level package used in AEC1 environments;
5) component thermal-mechanical simulation (crack, delam ,stress shift , metal ratcheting ,etc)