一、岗位职责Responsibilities:

1. 掌握使用 Xilinx Kintex Ultrascale 产品系列开发的能力，为我们内部针对 DRAM内存和Flash闪存的测试系统执行完整 FPGA 设计，以及具备所有必需的相关经验和行业知识；

Experience to perform full FPGA design using Xilinx Kintex Ultrascale product families for our in-house DRAM and Flash based tester products with all required relevant experience, and industry knowledge.

2. 掌握执行完整 FPGA 架构的设计和验证经验，如使用 Verilog、System-C 语言进行 IP 开发、行为和 RTL 模块仿真、将各种 IP 集成到最终模块、综合和复杂 FPGA 设计的时序收敛等。 验证整个 FPGA 的完整功能，用于大规模原型、工程样品和批量生产；

Experience of performing full FPGA architecture, IP development using Verilog, System-C languages, simulation of behavioral and RTL blocks, integration of various IP into final block, synthesize, implementation, and timing closure of complex FPGA designs. Verify the full functionality of entire FPGA for mass prototype, engineering sample, and mass production.

3. 在仿真中执行完整 DRAM 和闪存协议验证，以及在实验室使用真实硬件进行调试；

Experience of performing full DRAM and Flash protocol verification in simulation and bring up, debug in the lab using real hardware.

4. 根据最终设计规范审查最终产品的全面认证和量产验证；

Experience to review full validation and verification of final products against final design spec and release product to mass production.

5. 使用Xilinx 最新的现场可编程门阵列 (FPGA) 协同设计硬件产品；

Experience of co-design Hardware products with field programmable gate array (FPGA) preferably using Xilinx latest FPGA devices.

6. 掌握在实验室中开发产品并对 DRAM、闪存和 FPGA 硬件解决方案进行故障排除；

Experience to bring up products in the lab and troubleshoot Hardware solutions for DRAM, Flash, and FPGA.

7. 与所有公司内部技术团队进行定期、主动的沟通；

Regular, proactive communication with all IM’s internal technical teams.

8. 为内部和外部目的创建PPT等演示材料。

Creation of presentation material for internal and external purpose.

二、 任职要求：Qualifications:

1. 拥有5 年直接相关经验的电子工程博士或硕士学位，或8 年直接经验的电子工程学士学位；

Philosophy Doctorated in electrical engineering (Ph.D. EE) or Master degree in electrical engineering (MSEE) and 5 years of direct experience or Bachelor degree in electrical engineering (BSEE) and 8 years of direct experience of equivalent experiences.

2. 至少 5 年半导体行业经验，最好是 DRAM 内存和闪存产品线相关；

Minimum 5 years Semiconductor industry experience, ideally in DRAM and Flash product lines.

3. 能够在全球和多样化的环境中胜任团队合作，能够与不同层面的所有团队成员互动，包括FPGA、固件、软件、硬件设计、PCB 布局、测试工程、供应链等；

Ability to work in a global and diverse environment. Strong team spirit. Ability to interact with all team members on different levels: FPGA, Firmware, Software, Hardware design, PCB layout, Test Eng, MFG, Quality, FAE, Sales, Procurement, Supply Chain, or C-level.

Ability to work with international team across geographically dispersed area.

4. 优秀的沟通能力，口头和书面熟练使用英语和普通话。 其它语言专业知识是加分项。

Language skills: Excellent communication, verbal, and written fluency in English and Mandarin. Additional language expertise is a plus.

5. 积极主动的专业态度，愿意学习和提高现有的知识储备。

Proactive and professional attitude. Willing to learn and improve upon your existing knowledge.

三、 福利待遇：Welfare benefits

1. 双休，带薪年假及福利假期；下午茶点/自主咖啡/图书角/各种沙龙；

2. Double leave, paid annual leave and welfare leave; Afternoon tea/independent coffee/book corner/various salons;

3. 入职全额缴纳保险，六险一金；节假日各种福利/礼金；

4. Full payment of insurance, six insurance and one gold fund; Various holiday benefits/gifts；

5. 30多年半导体领域的国际团队；International team in semiconductor field for more than 30 years.

6. 开放、全新的办公场所；Open, brand new office space.

7. 工作地址：山东济南舜泰北路789号 Building A, No. 789, Shuntai North Road , Jinan,Shandong