Responsibilities:

• Support, contribute and promote a safe work environment.

• Perform signal integrity simulations for engineering designs on connectors or semiconductor IC chip test sockets or probe heads

• Develops technology and processes for high-speed measurement of test sockets, connectors, PCB’s and other components.

• Designs and develops PCBs and fixtures for testing and characterization of engineering designs.

• Set up machines, equipment and design/develop process fixtures.

• Responsible for prototyping and evaluation of new products in leading edge applications.

• Interprets customer specifications and writes test procedures to qualify new and existing products.

• Recommends capital investments for leading edge technologies that will keep the company on the forefront of the industry.

• Specify tooling and equipment needed to support the production build.

• Provide technical support to organizational stakeholders (Production, Quality, Marketing and Sales).

• Consult with Sales in quoting customer requirements and bid preparation.

• Participate and contribute to team training, development, mentoring and audits.

• Demonstrate behaviors consistent with company policies.

Requirement:

• General educational, experience and competency requirements defined in current revision of the “Engineering Career Ladder”.

• Knowledge of RF, Digital and Power cables and connectors or related knowledge.

• Familiar using HFSS to perform simulation to generate IL, RL, TDR, and Crosstalk.

• Understanding of RF/Signal Integrity simulations on electric-mechanical structures.

• Understanding of RF/Digital test equipment, software and procedures. Be able to use VNA to perform electrical measurement.

• Ability to perform Root Cause Analysis utilizing standard problem-solving tools and methodologies.

• Knowledge of 3D modeling using drawing and simulation packages.

• Knowledge of PCB design