职责描述：
1.负责电镀设备开发和迭代；
Responsible for ECP tool development and iterative optimization;
2.与机械、电气、软件等设计部门合作，提供设计建议和设备标准；
Responsible for co-working with mechanical, electrical, software design department, to provide design suggestion and tool standard;
3.负责设备硬件和软件测试标准（Check Sheet），安装调试流程（SOP），维护保养（PM）标准文件制定和撰写；
Responsible for tool hardware and software test check sheet, installation operating procedure (SOP), preventive maintenance (PM) formulate and write;
4.负责售后服务工程师培训;
Responsible for tool service engineer training;
5.作为产品组技术专家牵头解决设备技术问题;
As the production team expert lead to solve tool hardware technical issue。
任职要求：
1.5年以上晶圆厂（Fab）电镀设备工程师，或设备商售后服务工作经验；
Over 5years working experience as Fab plating hardware engineer or tool vendor service engineer
2.掌握半导体电镀设备硬件构造，原理和系统架构为佳；
Master in semiconductor plating tool Structure, mechanism and system architecture is preferred;
3.熟悉电镀工艺原理；
Familiar with plating process mechanism;
4.有电气和机械相关基础知识；
Expert in electrical and mechanical relevant basic knowledge;
5.有设备技术标准文件制定经验优先；
Experience in tool technical standard formulate and write is preferred;
6.本科以上理工科相关专业；
Bachelor degree and above, major in engineering;
7.擅长沟通并能适应一定程度加班；
Good at communication and for overtime work to complete tasks on time。