Accountabilites:
1. Responsible for developing the clip bond process and installing new process technology.
2. Executes Process Characterization, conducts FMDRC & DOE if necessary.
3. Define Key Process Input Variable, Key Process Output Variables and formulates characterization/ DOE matrix. Conducts Characterization/ DOE Analysis.
4. Executes prototype builds, customer sample builds, qualification builds.
5. Collaborates with ME to review existing/new machine, tools, conversion kits and fixtures of equipment used for NPIs. Work with them on the upgrades to support NPI development
6. Validates newly designed jigs and fixtures, perform characterization if necessary.
Qualifications:
1. Bachelor’s degree in Engineering field.
2. 4+ years semiconductor NPI experience in clip bond filed . Project management experience is an advantage.
3. Knowledge of APQP, PPAP, D/PFMEA, DoE, Engineering Statistics and Data Analysis, Process Flow, Control Plan, DFM.
4.Good Communication skill and negotiation skills, team work spirit and leadership.
5.Good English communication (Verbal & Written).