SUMMARY:
Heat dissipation quantitative analysis & heat design optimization, Component & system level heat dissipation simulation.
RESPONSIBILITIES:
1.Utilize thermal simulation software such as ANSYS Icepak, FloTHERM, etc., to analyze the thermal performance of package/board and system level under various operating conditions.
2.Provide thermal resistance parameters and thermal models.
3.Provide recommendations for design optimization based on simulation results to enhance heat dissipation efficiency and thermal management capabilities.
4.Work with design team to address thermal issues, make sure product thermal design *** time right.
5.Stay updated on the latest advancements in thermal simulation technologies and tools to continuously enhance the team's simulation capabilities.
6.Assist in engineering material thermal property characterization.
REQUIREMENTS:
1.Education background : MS degree in Engineering Mechanics, or engineering Materials, or microelectronics , or electronics related;
2.Experience in electrical simulation or thermoelectric coupling simulation is a plus ;
3.+3 years FEA work experience or +3 years' work experience in packaging design is a plus;
4.Strong knowledge and experience on thermal management / heat dissipation simulation.
5.Hands-on experience of major FEA tools (e.g., ANSYS, ABAQUS,Hypermesh), heat dissipation simulation tools (e.g., Icepak,Flotherm,etc. ) and modeling tools (e.g., Solidworks,ProE,etc);
6.Deep understanding of packaging materials （including soldering materials） and their mechanical behaviors;
7.Good at statistical data analysis.
8.Knowledge of electronic packaging structure and process, as well as its reliability.