职位详情
R&D Chief EngineerI(ECM)
8000-14000元
通用半导体(中国)有限公司
天津
3-5年
本科
11-18
工作地址

威世·通用半导体中国有限公司(西北门)

职位描述
Responsibility:
1. Be responsible for Molding and Trim & Form process to develop electronic components
2. Collaborate with the design team to brainstorm and develop creative concepts for electronic components
3. Assist in the creation of detailed product designs, including sketches, 3D models, and technical drawings
4. Participate in product testing and evaluation to ensure functionality, usability and quality
5. Support the design team in creating prototypes and mock-ups for presentation and user testing purposes
6. Assist in the preparation of design documentation, including design briefs, specifications and datasheet
Requirements:
1. Bachelor’s degree or above, Major in Mechanical engineering or Knowledge of material.
2. 3 years above of experience in product design or engineering field preferably automotive electronic products.
3. Working knowledge of 3D CAD programs.
4. Understanding design for manufacturability (DFM), design for assembly (DFA), statistical tolerance analysis techniques, functional dimensioning, and geometric tolerancing
5. Detail orientated, enthusiastic thinker, and capable of handling multiple assignments under high pressure
6. Good communication skills both of English and Chinese

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